Cooling system with common modular manifolds

A cooling system for a modular power control system (MPCS), the MPCS comprises a plurality of modules, each module having a chassis, the chassis comprising a first manifold segment and a second manifold segment, the cooling system comprising:

• an inlet;
• a first common manifold formed from the first manifold segment of each module, where when the plurality of modules is mounted to each other, the first manifold segments align to provide a fluid channel between endcaps;
• a second common manifold formed from the second manifold segment of each module, where when the plurality of modules is mounted to each other, the second manifold segments align to provide a fluid channel between endcaps,
• the chassis of at least two modules further has a first opening providing a fluid interface region between the first common manifold and a module specific flow path, and a second opening providing a fluid interface region between the module specific flow path and the second common manifold, where the module specific flow path provides at least one fluid branch between the first common manifold and the second common manifold;
• and
• an outlet,
• wherein the inlet is in fluid communication with an end of the first common manifold and the outlet is in fluid communication with the other end of the first common manifold or an end of the second common manifold, and
• wherein the inlet is connectable to a fluid source via a pump controlled to provide a set total fluid rate.