Cooling device for electronic apparatus

A computing device, comprising:

• a CPU;
• and
• a cooling device comprising:
• a heat sink configured to dissipate heat generated from the CPU by allowing air introduced from an outside of the computing device to pass between a plurality of fins;
• a first air blower that comprises a first discharge surface for discharging air introduced from the outside toward the heat sink;
• a second air blower having the same size as the first air blower and comprises a second discharge surface for discharging air introduced from the outside toward the heat sink;
• and
• an exhaust port configured to discharge air that passes between the fins to the outside, wherein
• a sum of a diameter of the first discharge surface and a diameter of the second discharge surface is larger than a width of the heat sink, and the first discharge surface and the second discharge surface are provided upstream of the fins so as to be symmetrical relative to a plane with an included angle of 90 degrees or more between the first discharge surface and the second discharge surface, the plane passing through a central position in a width direction of the heat sink and being parallel to the fins.

A heat reduction method for an electronic apparatus, comprising:

• dissipating heat generated from the electronic apparatus by allowing air introduced from an outside to pass between a plurality of fins comprised in a heat sink;
• discharging air introduced from the outside toward the heat sink using a first air blower that comprises a first discharge surface;
• discharging air introduced from the outside toward the heat sink using a second air blower having the same size as the first air blower and comprises a second discharge surface;
• and
• discharging air that passes between the fins to the outside through an exhaust port, wherein
• a sum of a diameter of the first discharge surface and a diameter of the second discharge surface is larger than a width of the heat sink, and the first discharge surface and the second discharge surface are provided upstream of the fins so as to be symmetrical relative to a plane with an included angle of 90 degrees or more between the first discharge surface and the second discharge surface, the plane passing through a central position in a width direction of the heat sink and being parallel to the fins.