Printed circuit board over printed circuit board assembly

An electronic system assembly, comprising:

• a first circuit substrate having a first surface, wherein the first surface has a two-dimensional area defined in a first dimension and a second dimension;
• a plurality of semiconductor chip packages mounted on and electrically coupled to the first surface;
• a plurality of second circuit substrates arranged over the first surface, wherein each semiconductor chip package of the plurality of semiconductor chip packages is arranged between the first surface and a respective second circuit substrate of the plurality of second circuit substrates in a third dimension;
• a plurality of conductive interconnect structures that extend in the third dimension,
• wherein the plurality of conductive interconnect structures are provided in a plurality of interconnect groups, and
• wherein each interconnect group of the plurality of interconnect groups connects a different second circuit substrate of the plurality of second circuit substrates to the first circuit substrate;
• and
• a plurality of storage capacitors, wherein each storage capacitor of the plurality of storage capacitors is mounted and electrically coupled to a respective second circuit substrate of the plurality of second circuit substrates.

A method of manufacturing an electronic system assembly, the method comprising:

• mounting a plurality of first semiconductor chip packages onto a surface of a first circuit substrate in electrical contact with the first circuit substrate, wherein the surface of the first circuit substrate has a two-dimensional area defined in a first dimension and a second dimension;
• mounting a plurality of second semiconductor chip packages to a plurality of second circuit substrates, wherein each second semiconductor chip package of the plurality of second semiconductor chip packages is mounted and electrically coupled to a respective second circuit substrate of the plurality of second circuit substrates;
• coupling a plurality of conductive interconnect structures to the plurality of second circuit substrates, wherein the plurality of conductive interconnect structures are provided in a plurality of interconnect groups and each interconnect group of the plurality of interconnect groups is coupled to a different second circuit substrate of the plurality of second circuit substrates to form a different bridge structure of a plurality of bridge structures;
• and
• coupling each bridge structure of the plurality of bridge structures to the first circuit substrate, wherein the plurality of second circuit substrates are arranged over the surface of the first circuit substrate, wherein the plurality of conductive interconnect structures extend in a third dimension substantially perpendicular to the two-dimensional area, and wherein each first semiconductor chip package of the plurality of first semiconductor chip packages is arranged between the surface of the first circuit substrate and a respective second circuit substrate of the plurality of second circuit substrates in the third dimension.