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US 2024/0206068 A1Published application
Printed circuit board
AssigneeSamsung Electronics Co., Ltd.
InventorsYang LIU, Zhenrong YANG
Life of this patent
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AssigneeSamsung Electronics Co., Ltd.
InventorsYang LIU, Zhenrong YANG
Estimating the term…
A printed circuit board, divided into a printed circuit board area and a peripheral area surrounding the printed circuit board area, includes: a plurality of unit printed circuit boards provided in the printed circuit board area; a base portion provided in the peripheral area and the printed circuit board area, and including a circuit pattern portion and an insulating material portion; a first solder resist portion provided in the peripheral area on a first surface of the base portion and a second surface of the base portion, the first surface being opposite to the second surface; and a second solder resist portion provided in the printed circuit board area on the first surface of the base portion and the second surface of the base portion. The first solder resist portion surrounds the second solder resist portion in the printed circuit board area. The first solder resist portion includes a first filler and the second solder resist portion includes a second filler that is different from the first filler.
A printed circuit board, divided into a printed circuit board area and a peripheral area surrounding the printed circuit board area, the printed circuit board comprising:
A printed circuit board comprising:
A printed circuit board comprising:
Dependencies are inferred from the claim text.