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US 2024/0205609 A1Published application
Voice coil structure and loudspeaker
AssigneeTransound Electronics Co., Ltd.
InventorsTSENG-FENG WEN, CHUN-HAN HUANG, CHUNG-HSIEN TSENG
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Abstract
The present disclosure provides a voice coil structure and a loudspeaker. The voice coil structure includes a substrate, a first wiring layer disposed on the substrate, and a first insulation layer disposed on the first wiring layer. The first wiring layer has a winding structure. The first wiring layer further includes a first end and a second end. The first insulation layer defines a through hole and a first notch. The first end is exposed from the through hole, and the second end is exposed from the first notch.
Claims20
A voice coil structure comprising:
- a substrate;
- a first wiring layer disposed on the substrate and having a winding structure, the first wiring layer comprising a first end and a second end;
- and
- a first insulation layer disposed on the first wiring layer, the first insulation layer defining a through hole and a first notch, the first end exposed from the through hole, and the second end exposed from the first notch.
1 more element
A loudspeaker comprising:
- a diaphragm;
- and
- a voice coil structure comprising:
- a substrate;
- a first wiring layer disposed on the substrate, the first wiring layer having a winding structure, the first wiring layer comprising a first end and a second end;
- and
- a first insulation layer disposed on the first wiring layer, the first insulation layer defining a through hole and a first notch, the first end exposed from the through hole, the second end exposed from the first notch, a surface of the substrate away from the first wiring layer disposed on the diaphragm.
4 more elements
Dependencies are inferred from the claim text.