Back to results
US 2024/0205598 A1Published application
Proximate dual mems microphones, systems, devices, and methods
OwnerDean Robert Gary Anderson, Dean Gregory Anderson +1inventors
InventorsDean Robert Gary Anderson, Dean Gregory Anderson, Daniel Anderson
Life of this patent
Estimating the term…
Abstract
In one embodiment of an audio system, the audio system comprises signal summation of two MEMS microphones in close acoustical proximity for speech frequencies to provide various benefits and improvements, including improvements to: speech intelligibility, signal-to-noise ratio, effective equivalent input noise, and at-a-distance acoustic signal reception.
Claims18
An audio system, comprising:
- a substrate having a first surface and a second surface opposite the first surface, wherein the substrate forms a hole extending from the first surface to the second surface;
- a first MEMS microphone mounted to the first surface of the substrate, the first MEMS microphone comprising a first package, a first sensor, and a first integrated circuit, wherein the first package forms a first sound port and wherein the first sound port is positioned over the hole in the substrate;
- a second MEMS microphone mounted to the second surface of the substrate, the second MEMS microphone comprising a second package, a second sensor, and a second integrated circuit, wherein the second package forms a second sound port and wherein the second sound port is positioned over the hole in the substrate, and wherein the second sound port is positioned within 3 millimeters of the first sound port.
An audio system, comprising:
- a substrate having a top surface, a bottom surface opposite the first surface and substantially parallel to the top surface, and an edge surface extending from the top surface to the bottom surface, wherein the edge surface defines a slotted recess extending into the substrate;
- a first MEMS microphone mounted to the first surface of the substrate, the first MEMS microphone comprising a first package, a first sensor, and a first integrated circuit, wherein the first package forms a first sound port and wherein the first sound port is positioned over the slotted recess;
- a second MEMS microphone mounted to the second surface of the substrate, the second MEMS microphone comprising a second package, a second sensor, and a second integrated circuit, wherein the second package forms a second sound port and wherein the second sound port is positioned over the slotted recess, and wherein the second sound port is positioned within 3 millimeters of the first sound port.
An audio system, comprising:
- a substrate having a top surface, a bottom surface opposite the first surface and substantially parallel to the top surface, and an edge surface extending from the top surface to the bottom surface;
- a first MEMS microphone mounted to the first surface of the substrate, the first MEMS microphone comprising a first sound port and wherein a portion of the first MEMS microphone extends beyond the edge of the substrate such that the first sound port is not positioned over the substrate;
- a second MEMS microphone mounted to the first surface of the substrate, the second MEMS microphone comprising a second sound port and wherein a portion of the second MEMS microphone extends beyond the edge of the substrate such that the second sound port is not positioned over the substrate, and wherein the second sound port is positioned within 3 millimeters of the first sound port.
Dependencies are inferred from the claim text.