Light-emitting diode (led) device with indentations
AssigneeLumileds LLC
InventorBarbara Roswitha MÜLDERS
Life of this patent
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Abstract
Light-emitting diode (LED) devices are described herein. An LED device includes a substrate. The substrate has a top surface and a bottom surface opposite the top surface. The bottom surface has at least one indentation that runs lengthwise across at least a portion of the substrate. The LED device also includes a semiconductor surface mounted device (SMD) over the top surface of the substrate.
Claims20
A light-emitting diode (LED) device comprising:
- a substrate comprising a top surface and a bottom surface opposite the top surface, the bottom surface of the substrate comprising at least one indentation that runs lengthwise across an entire length of the substrate;
- and
- a semiconductor surface mounted device (SMD) over the top surface of the substrate.
(canceled)
The device according to claim 0, wherein the at least one indentation at least runs under the SMD.
The device according to claim 0, wherein the at least one indentation is a groove.
The device according to claim 0, wherein:
- the SMD comprises one or more LED dies on a ceramic sub-mount, and
- the substrate comprises at least one of an insulated metal substrate or a metal heatsink.
An LED module comprising a substrate comprising a top surface and a bottom surface opposite the top surface, the bottom surface of the substrate comprising at least one indentation that runs lengthwise across an entire length of the substrate;
- a semiconductor surface mounted device (SMD) over the top surface of the substrate;
- and
- an electrical connector configured to provide power to the one or more LED dies.
A vehicle headlight comprising:
- a lamp fixture;
- and
- a light-emitting diode (LED) device mounted to the lamp fixture, the LED device comprising:
- a substrate comprising a top surface and a bottom surface opposite the top surface, the bottom surface of the substrate comprising at least one indentation that runs lengthwise across an entire length of the substrate, and
- a semiconductor surface mounted device (SMD) over the top surface of the substrate.
Dependencies are inferred from the claim text.