US 2024/0204158 A1Published application

Wiring substrate, light-emitting device, and manufacturing methods thereof

AssigneeNichia Corporation

InventorKenji SUZUKI

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Abstract

A wiring substrate including a substrate including an insulating portion with a through hole connecting a first surface and a second surface, and a metal portion faces the second surface and closes the through hole to form a blind hole. A conductor is disposed in the blind hole. The metal portion being a bottom surface defining the blind hole includes a first recess, a second recess, and a first lateral wall between the first and second recesses. In a cross-sectional view, the first lateral wall includes a first lower end portion in the first recess, a second lower end portion in the second recess, and a first top portion between the first and second lower end portions, The first top portion is immediately above a bottom surface defining the first recess, and the first lower end portion is closer to the second recess than the first top portion.

Claims32

Dependent claims

A wiring substrate comprising:

a substrate comprising an insulating portion and a metal portion, the insulating portion having a first surface and a second surface opposite to the first surface, the insulating portion comprising a through hole penetrating and connecting the first surface and the second surface, the metal portion facing the second surface of the insulating portion, the metal portion closing the through hole to form a blind hole;
and
a conductor disposed in the blind hole,
wherein a portion of the metal portion being a bottom surface defining the blind hole comprises at least a first recess, a second recess, and a first lateral wall located between the first recess and the second recess, and
wherein, in a cross-sectional view taken along a thickness direction of a portion of the metal portion located in the blind hole, the first lateral wall comprises a first lower end portion located in the first recess, a second lower end portion located in the second recess, and a first top portion located between the first lower end portion and the second lower end portion, the first top portion is located immediately above a bottom surface defining the first recess, and the first lower end portion is located closer to the second recess than the first top portion.

2 more elements

A method of manufacturing a wiring substrate, the method comprising:

providing a substrate comprising an insulating portion and a metal portion, the insulating portion having a first surface and a second surface opposite to the first surface, the metal portion facing the second surface of the insulating portion;
forming a primary blind hole by irradiating a first surface of the insulating portion with first laser light and removing at least a part of the insulating portion;
forming a blind hole having a portion of the metal portion as a bottom surface by irradiating a bottom surface defining the primary blind hole with second laser light having a shorter wavelength than the first laser light;
disposing a conductive paste in the blind hole;
and
forming a conductor by curing the conductive paste,
wherein, in the forming the blind hole, the second laser light is irradiated in such a manner that, in the portion of the metal portion being the bottom surface defining the blind hole, a plurality of recesses comprising at least a first recess and a second recess are formed, and a first lateral wall is formed between the first recess and the second recess.

4 more elements

Dependencies are inferred from the claim text.