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US 2024/0204130 A1Published application
Method of manufacturing an electronic device
AssigneeCommissariat à I'Énergie Atomique et aux Énergies Alternatives
InventorsLudovic Dupre, Carole Pernel
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Abstract
A method of manufacturing an electronic device comprising the following successive steps: a) forming a structure comprising a diode stack disposed on a first substrate, and a sacrificial layer of semiconductor material interposed between the first substrate and the diode stack; b) transferring the structure to a second substrate; and c) removing the first substrate by electropolishing the sacrificial layer by applying a bias voltage to the sacrificial layer via the diode stack.
Claims15
A method of manufacturing an electronic device comprising the following successive steps:
- a) forming a structure comprising a diode stack disposed on a first substrate, and a sacrificial layer of semiconductor material interposed between the first substrate and the diode stack;
- b) transferring the structure to a second substrate;
- and
- c) removing the first substrate by electropolishing the sacrificial layer by applying a bias voltage to the sacrificial layer via the diode stack.
1 more element
Dependencies are inferred from the claim text.