Device having an in-substrate inductor and method for making the inductor

A device including an inductor, the inductor comprising:

• a substrate having a first planar surface and a second planar surface opposite the first planar surface;
• a first row of vias disposed through the substrate and filled with a conductive metal;
• a second row of vias disposed through the substrate and filled with the conductive metal, wherein the second row of vias is laterally displaced from the first row of vias;
• a via structure disposed through the substrate and extending generally parallel to both the first row of vias and the second row of vias, the via structure being filled with a magnetic material to form a magnetic core of the inductor that is electrically insulated from the conductive metal filling the first row of vias and the conductive metal filling the second row of vias;
• a first patterned metallization layer exterior to the first planar surface and interconnecting the conductive metal of each via of the first row of vias with the conductive metal of a corresponding via of the second row of vias;
• and
• a second patterned metallization layer exterior to the second planar surface and interconnecting the conductive metal of each via of the first row of vias with the conductive metal of a corresponding via of the second row of vias;
• wherein the first patterned metallization layer, the second patterned metallization layer, the conductive metal filling the first row of vias, and conductive metal filling the second row of vias form a winding of the inductor about the magnetic core.

A method of fabricating an inductor, comprising:

• forming a plurality of vias disposed through a substrate and filled with a conductive metal;
• forming a via structure disposed through the substrate and filled with a magnetic material, the via structure extending between the plurality of vias and forming a magnetic core of the inductor;
• and
• forming one or more patterned metallization layers interconnecting the conductive metal of the plurality of vias;
• wherein the one or more patterned metallization layers and the conductive metal filling the plurality of vias form a winding of the inductor about the magnetic core.

A method of fabricating an inductor, comprising:

• forming a first row of vias through a substrate;
• forming a second row of vias through the substrate, wherein the second row of vias is laterally displaced from the first row of vias;
• forming a via structure through the substrate extending generally parallel to both the first row of vias and the second row of vias;
• filling the first row of vias and the second row of vias with a conductive metal;
• filling the via structure with a magnetic material;
• forming a first patterned metallization layer exterior to a first planar surface of the substrate to electrically interconnect the conductive metal of each via of the first row of vias with the conductive metal of a corresponding via of the second row of vias;
• and
• forming a second patterned metallization layer exterior to a second planar surface of the substrate opposite the first planar surface to electrically interconnect the conductive metal of each via of the first row of vias with the conductive metal of a corresponding via of the second row of vias;
• wherein the first patterned metallization layer, the second patterned metallization layer, the conductive metal filling the first row of vias, and conductive metal filling the second row of vias form a winding of the inductor about a magnetic core formed by the magnetic material in the via structure.