Optical package structure and method for manufacturing the same

A method for manufacturing an optical package structure, comprising processes of:

• forming a plurality of first bonding layers having an enclosed shape on a bonding surface of a flat-shaped light transmittable board;
• forming a plurality of light-absorption layers on the plurality of first bonding layers, respectively;
• forming a plurality of second bonding layers on the plurality of light-absorption layers, respectively;
• slicing the light transmittable board into a plurality of light transmittable members, wherein each of the light transmittable members includes one of the first bonding layers, one of the light-absorption layers, and one of the second bonding layers, so as to form a bonding structural member;
• and
• providing a plurality of optical elements, orienting the bonding surface of the light transmittable members toward the optical element, bonding the second bonding layer to the plurality of optical elements, and configuring the bonding structural member to surround an optical function region of the optical elements.

A method for manufacturing an optical package structure, comprising processes of:

• forming a plurality of first bonding layers having an enclosed shape on a bonding surface of a flat-shaped light transmittable board;
• forming a plurality of light-absorption layers on the plurality of first bonding layers, respectively;
• forming a plurality of second bonding layers on the plurality of light-absorption layers, respectively, so as to form a plurality of bonding structural members;
• wherein each of the bonding structural members includes one of the first bonding layers, one of the light-absorption layers, and one of the second bonding layers;
• providing a wafer, orienting the bonding surface of the light transmittable board toward the wafer, bonding the plurality of second bonding layers to the wafer, and configuring each of the bonding structural members to surround a plurality of optical function regions of the wafer;
• and
• slicing the light transmittable board and the wafer, so that the light transmittable board is divided into a plurality of light transmittable members, and the wafer is divided into a plurality of optical elements;
• wherein each of the optical elements includes one of the optical function regions, and the plurality of bonding structural members are bonded between the plurality of light transmittable members and the plurality of optical elements, respectively.