Methods of forming semiconductor packages

A method comprising:

• aligning first regions of a first package component with second regions of a second package component;
• performing laser shots on the first package component with a laser beam, each respective laser shot of the laser shots being performed sequentially in a different respective first region of the first regions of the first package component, a conductive material between the respective first region and a respective second region of the second regions of the second package component being reflowed by the respective laser shot, wherein each respective laser shot is performed on a back-side of the first package component, and heat generated by the laser beam is transferred through the first package component to the conductive material;
• and
• after performing the laser shots, singulating the first regions of the first package component and the second regions of the second package component.

A method comprising:

• placing a first package component on a second package component, the first package component comprising first conductive connectors in a first package region and second conductive connectors in a second package region, the first package region adjacent the second package region;
• reflowing the first conductive connectors by performing a first laser shot at the first package region until the first conductive connectors are molten, the second conductive connectors not being molten;
• and
• reflowing the second conductive connectors by performing a second laser shot at the second package region until the second conductive connectors are molten, the first conductive connectors not being molten.