Method of embedding a bare die in a carrier laminate

Abstract

A method of embedding a bare die in a carrier laminate is provided. The method includes providing the bare die including a metal layer on a front side of the bare die or on a back side of the bare die opposite the front side. A layer is formed over the metal layer. The bare die is mounted in a recess of the carrier laminate with the layer facing an opening of the recess. The recess is filled with a dielectric material. A portion of the dielectric material that is on the layer is removed. A metal structure is deposited over at least a portion of the layer and at least a portion of the carrier laminate.

Dependencies are inferred from the claim text.