Apparatus for bonding electronic component, method for bonding electronic component, and method for manufacturing light-emitting diode display

A method for bonding an electronic component, comprising:

• providing a first substrate having a bonded surface;
• providing a second substrate having a surface on which the electronic component to be bonded is disposed;
• placing the first substrate and the second substrate in a way that the bonded surface of the first substrate faces the surface of the second substrate on which the electronic component to be bonded is disposed;
• arranging the first substrate and the second substrate to be in a non-parallel configuration;
• moving the first substrate and/or the second substrate to approach each other in the non-parallel configuration till the first substrate contacts the second substrate at a contact region;
• continuing to move the first substrate and/or the second substrate to achieve a full contact of the first substrate and the second substrate from the mere contact of the contact region;
• and
• applying an energy beam to bond the electronic component from the second substrate onto the bonded surface of the first substrate.