Semiconductor device, drive device for semiconductor device, manufacturing method for semiconductor device

Abstract

A semiconductor device includes a semiconductor element, a first wire, a second wire, and a metal portion. The semiconductor element includes an element obverse surface and an element reverse surface facing away from each other in a thickness direction, and an electrode disposed on the element obverse surface. The first wire contains a first metal. The second wire contains a second metal having a thermoelectric power different from that of the first metal. The metal portion contains a third metal and is disposed such that heat from the semiconductor element is conducted thereto. The first wire and the second wire are bonded to the metal portion. At least one of the first wire and the second wire is directly bonded to the metal portion.

Dependencies are inferred from the claim text.