US 2024/0203928 A1Published application

Metal wiring board

AssigneeFuji Electric Co., Ltd.

InventorsYushi SATO, Kazuo ENOMOTO

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Abstract

A metal wiring for connecting a semiconductor element and to a circuit board, includes: a first joining portion having a rectangular shape in a planar view and configured to be joined to an upper surface of a main electrode of the semiconductor element; a second joining portion having a rectangular shape in the planar view and joined to an upper surface of the circuit board; and a coupling portion having first and second joining sides, respectively connected to coupling sides of the first and second joining portions so as to couple the first and second joining portions such that the coupling sides of the first and second joining portions face each other. The first joining side of the coupling portion is coupled to the coupling side of the first joining portion approximately at a center thereof in a first direction parallel to the coupling side of the first joining portion.

Claims15

Dependent claims

A metal wiring board for connecting a semiconductor element to a circuit board, comprising:

a first joining portion having a rectangular shape in a plan view of the metal wiring board and being configured to be joined to an upper surface of a main electrode of the semiconductor element,
a second joining portion having a rectangular shape in the plan view and being configured to be joined to an upper surface of the circuit board, and
a coupling portion having a first joining side and a second joining side, respectively connected to a coupling side of the first joining portion and a coupling side of the second joining portion so as to couple the first joining portion to the second joining portion such that the coupling side of the first joining portion and the coupling side of the second joining portion face each other, wherein
the first joining side of the coupling portion is coupled to the coupling side of the first joining portion approximately at a center thereof in a first direction parallel to the coupling side of the first joining portion.

1 more element

Dependencies are inferred from the claim text.

Facts

Application: 18/590,567Filed 28 Feb 2024
Priority: JP 2022-05104128 Mar 2022
Published: 20 Jun 2024
Term ends: Not estimatedThe source records don’t support an estimate.

Classification21 codes

H10W 90/00
Package configurations
H10W 72/071
Interconnections or connectors in packages: connecting or disconnecting
H10W 72/073
Connecting or disconnecting: of die-attach connectors
H10W 72/076
Connecting or disconnecting: of strap connectors

Family

Application18/590,567Continuation
US 2024/0203928 A1This patent

From the US filing history. Foreign family members aren’t listed.

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