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US 2024/0203906 A1Published application
Package structure and method for forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTsung-Fu TSAI, Kung-Chen YEH, I-Ting HUANG, Shih-Ting LIN, Szu-Wei LU
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Abstract
A method for forming a package structure is provided, which includes recessing a substrate to form a trench, disposing a first stacked die package structure over the substrate, forming an underfill layer over the first stacked die package structure and in the trench, and forming a package layer over the underfill layer and in the trench.
Claims20
A method for forming a package structure, comprising:
- recessing a substrate to form a trench;
- disposing a first stacked die package structure over the substrate;
- forming an underfill layer over the first stacked die package structure and in the trench;
- and
- forming a package layer over the underfill layer and in the trench.
2 more elements
A package structure, comprising:
- a substrate;
- a first stacked die package structure disposed on the substrate;
- and
- a package layer surrounding the first stacked die package structure, wherein the package layer has an extending portion extending into the substrate.
1 more element
A package structure, comprising:
- a substrate;
- a first stacked die package structure stacked over a first surface the substrate, wherein a first plane is defined by the first surface;
- and
- an underfill layer covering the first stacked die package structure and comprising a first part above the first plane and a second part below the first plane.
1 more element
Dependencies are inferred from the claim text.