Module

A module comprising:

• one or more electronic components disposed and aligned such that lower ends thereof are positioned on a reference surface;
• one or more pad electrodes disposed such that lower ends thereof are positioned on the reference surface;
• and
• a sealing resin disposed to seal the one or more pad electrodes and the one or more electronic components from above, wherein
• the sealing resin has a first surface serving as an upper surface and a second surface serving as a side surface,
• the first surface and the second surface are covered with a shield film,
• a first wire is disposed in the sealing resin to electrically connect the one or more pad electrodes and the shield film at a first point selected from the first surface and the second surface,
• a second wire is disposed in the sealing resin to electrically connect the one or more pad electrodes and the shield film at a second point selected from the first surface and the second surface, and
• the first point and the second point are different in height when viewed from the reference surface.