Semiconductor device and method of producing the same

A semiconductor device comprising:

• a wiring board having a first surface and a ground electrode, the ground electrode exposed to the first surface;
• a stacked body disposed above the first surface and having a chip structure body and a first resin layer, the first resin layer sealing the chip structure body;
• a second resin layer sealing the stacked body;
• a third resin layer disposed between the wiring board and the stacked body;
• and
• a first conductive shield layer disposed between the first resin layer and the first surface and disposed between the first resin layer and the second resin layer, and the first conductive shield layer being in contact with the ground electrode, wherein
• the first conductive shield layer is in contact with a side surface of the first resin layer, and
• when looking toward the ground electrode from a direction perpendicular to the first surface, the ground electrode is disposed outside of the first resin layer.