Electromagnetic shielding structure

A semiconductor package, comprising:

• a core layer;
• a core through hole formed in the core layer, the core through hole defining a surface;
• a dielectric material disposed in the core through hole, the dielectric material forming a first dielectric through hole and a second dielectric through hole;
• a first metal layer plated to the first dielectric through hole;
• and
• a second metal layer plated to the second dielectric through hole, wherein the first metal layer comprises a first via and the second metal layer comprises a second via.

An electromagnetic (EM) shielding insert for a core of a semiconductor package, the EM shielding insert comprising:

• a dielectric material that includes a first through hole and a second through hole;
• a first via disposed in the first through hole;
• a second via disposed in the second through hole;
• and
• a metal layer surrounding the dielectric material.