Substrate and package structure

Abstract

A substrate is disclosed, the substrate includes a plurality of electrically interconnected metal layers sequentially stacked from the top downward and dielectric layers interposed between the metal layers. The substrate has a low-side power connection region where metal strips in at least one of the metal layers extend in a direction different from a direction of extension of metal strips in another one of the metal layers extend. This enables a package structure incorporating the substrate to have a good stress distribution, which guarantees reliability required by long-term use. Also provided is a package structure including the substrate and a semiconductor die flipped and mounted on the substrate.

Dependencies are inferred from the claim text.