Semiconductor device with power supply distribution networks on frontside and backside of a circuit

A semiconductor device comprising:

• one or more circuits coupled to a frontside power distribution network and a backside power distribution network;
• one or more connecting vias disposed between the frontside power distribution network and the backside power distribution network that couple the frontside power distribution network with the backside power distribution network;
• wherein the backside power distribution network includes a first power supply, a second power supply, and a first portion of a third power supply;
• the frontside power distribution network includes a second portion of the third power supply coupled to the first portion of the third power supply by at least one of the one or more connecting vias;
• and the one or more circuits receive power from the first power supply, the second power supply, and the third power supply within the same circuit row.

A semiconductor device comprising:

• one or more circuits coupled to a frontside power distribution network and a backside power distribution network;
• one or more connecting vias disposed between the frontside power distribution network and the backside power distribution network that couple the frontside power distribution network with the backside power distribution network;
• wherein the backside power distribution network includes a first power supply and a second power supply having a first portion and a second portion;
• the frontside power distribution network includes a third power supply;
• the first portion of the second power supply is coupled to the one or more circuits;
• the second portion of the second power supply provides power to the third power supply on the frontside power distribution network;
• and the one or more circuits receive power from the first power supply, the second power supply, and the third power supply within the same circuit row.