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US 2024/0203871 A1Published application
Integrated circuit bump integrated with tcoil
AssigneeQUALCOMM Incorporated
InventorsHongmei LIAO, Xiaohua KONG
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Abstract
An integrated circuit (IC) including an IC bump; and a Tcoil situated directly below the IC bump, wherein the Tcoil is electrically coupled to the IC bump by way of a metallized via hole.
Claims35
An integrated circuit (IC), comprising:
- an IC bump;
- and
- a Tcoil situated directly below the IC bump, wherein the Tcoil is electrically coupled to the IC bump by way of a first metallized via hole.
A data communication system, comprising:
- a printed circuit board (PCB) comprising a set of transmission lines;
- and
- a first integrated circuit (IC) mounted on the PCB, wherein the first IC includes a first set of IC interface circuits, comprising:
- a first set of IC bumps electrically coupled to the set of transmission lines, respectively;
- and
- a first set of Tcoils, each Tcoil of the first set of Tcoils situated directly below a respective IC bump of the first set of IC bumps, wherein the first set of Tcoils are electrically coupled to the first set of IC bumps by way of a first set of metallized via holes, respectively.
3 more elements
A wireless communication device, comprising:
- at least one antenna;
- a transceiver coupled to the at least one antenna;
- and
- an integrated circuit (IC) including one or more signal processing cores, wherein the IC includes a set of IC interface circuits, comprising:
- a set of IC bumps electrically coupled to a set of transmission lines electrically coupling the IC to the transceiver, respectively;
- and
- a set of Tcoils, each Tcoil of the set of Tcoils situated directly below a respective IC bump of the set of IC bumps, wherein the set of Tcoils are electrically coupled to the set of IC bumps by way of a set of metallized via holes, respectively.
4 more elements
An integrated circuit (IC), comprising:
- a set of differential IC bump;
- and
- a set of differential Tcoils situated at least partially directly below the set of differential IC bumps, wherein the set of differential Tcoils is electrically coupled to the set of differential IC bumps by way of a set of metallized via hole, respectively.
Dependencies are inferred from the claim text.