Integrated circuit devices with hybrid metal lines

An integrated circuit (IC) device comprising:

• a support structure;
• a metal line over the support structure, the metal line extending along an axis;
• and
• an opening extending through the metal line, the opening comprising an insulator material and separating the metal line into a first segment and a second segment,
• wherein the first segment and the second segment extend along the axis on opposite sides of the opening, and wherein the opening tapers down towards the support structure.

A method of manufacturing an integrated circuit (IC) device, the method comprising:

• providing a metal line over a support structure, the metal line comprising a first segment, a second segment, and a third segment in contact with the first and second segments, wherein:
• the first and second segments comprise a first electrically conductive material,
• the third segment comprises a second electrically conductive material, and
• the second electrically conductive material is different from the first electrically conductive material;
• removing a portion of the second electrically conductive material to create an opening through the third segment;
• and
• depositing an insulator material into the opening.