Dry film photoresist wet lamination and method

An electronic device comprising:

• a substrate including a conductor coating;
• a via connected to the conductor coating;
• a solder resist layer on the substrate, the solder resist layer defining a channel that the via is formed within and insulating the via during operation of the electronic device;
• a top layer interproximal to the substrate and the via;
• and
• one or more dies connected to the via.

A method of making a substrate for an electronic device comprising:

• dispensing a liquid on at least a portion of a surface of a core, the surface of the core including one or more surface features, the liquid filling the one or more surface features to form a liquid layer;
• laminating a dry film photoresist layer on the liquid layer;
• absorbing, with the dry film photoresist layer, at least a portion of the liquid from the liquid layer;
• swelling, with the dry film photoresist layer, to fill the one or more surface features;
• and
• curing the dry film photoresist layer by exposing the dry film photoresist layer to an energy source.