Semiconductor device and mounting structure for semiconductor device

Abstract

A semiconductor device includes a semiconductor element, a sealing resin, and a first signal terminal. The sealing resin includes a first surface facing in a thickness direction and covers the semiconductor element. The first signal terminal protrudes from the first surface and is electrically connected to the semiconductor element. The sealing resin includes a second surface facing the same side as the first surface in the thickness direction. The first surface includes a first region which is located opposite to the first signal terminal the with second surface interposed therebetween in a first direction orthogonal to the thickness direction and on which a mounting member can be disposed. The position of the second surface differs from the position of the first region in the thickness direction.

Dependencies are inferred from the claim text.