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US 2024/0203840 A1Published application
Lead frame and package method
AssigneeRichtek Technology Corporation
InventorsShih-Chieh Lin, Min-Shun Lo, Heng-Chi Huang, Yong-Zhong Hu
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Abstract
A lead frame includes: a die pad having a die disposing area; a plurality of lead pads located around the die pad; an outer frame, located at a periphery of the die pad and the lead pads; and at least two tie bars, respectively connected between the outer frame and two opposite sides of the die pad. At least one of the die pad and the tie bars includes a thermal deformation mitigation structure.
Claims12
A lead frame, including:
- a die pad having a die disposing area;
- a plurality of lead pads located around the die pad;
- an outer frame, located at a periphery of the die pad and the lead pads;
- at least two tie bars, respectively connected between the outer frame and two opposite sides of the die pad;
- wherein at least one of the die pad and the tie bars includes a thermal deformation mitigation structure.
2 more elements
A package method, comprising:
- providing a lead frame, which includes a die pad, a plurality of lead pads, an outer frame, and at least two tie bars separately connected between the die pad and the outer frame, wherein at least one of the die pad and the tie bars includes a thermal deformation mitigation structure;
- putting a pressing tool on the outer frame;
- and
- disposing a chip die on the die pad, and/or disposing a plurality of lead wires on the corresponding lead pads;
- wherein the thermal deformation mitigation structure includes a multi-thickness structure in at least one of the die pad and the tie bars.
2 more elements
Dependencies are inferred from the claim text.