Semiconductor package including a high voltage semiconductor die and a gate driver semiconductor die, and method of producing the semiconductor package

A method of producing a plurality of semiconductor packages, the method comprising:

• forming a gate driver circuit at a plurality of die locations in a semiconductor wafer;
• thinning a backside of the semiconductor wafer;
• covering the thinned backside of the semiconductor wafer with a polymer material;
• singulating the semiconductor wafer with the polymer material into a plurality of gate driver semiconductor dies;
• and
• for each gate driver semiconductor die:
• attaching a high voltage semiconductor die to an electrically conductive part of a substrate;
• and
• attaching, by an electrically insulative die attach material, the gate driver semiconductor die to the electrically conductive part of the substrate or to a side of the high voltage semiconductor die that faces away from the substrate,
• wherein the polymer material is interposed between a semiconductor body of the gate driver semiconductor die and the die attach material such that the semiconductor body is electrically insulated from the substrate or the side of the high voltage semiconductor die that faces away from the substrate by an insulator stack that comprises both the polymer material and the die attach material.