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US 2024/0203816 A1Published application
Heat dissipation structures for bonded wafers
AssigneeInternational Business Machines Corporation
InventorsKisik Choi, Nicholas Alexander POLOMOFF, Brent A. Anderson, Lawrence A. Clevenger, Ruilong Xie, Terence Hook, Matthew Angyal, FEE LI LIE
Life of this patent
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Abstract
Semiconductor devices and methods of forming the same include a front-end-of-line (FEOL) layer. A back-end-of-line (BEOL) layer includes a thermal transfer structure in contact with the FEOL layer. A carrier wafer is bonded to the BEOL layer and includes a thermal dissipation structure in contact with the thermal transfer structure.
Claims20
A semiconductor device, comprising:
- a front-end-of-line (FEOL) layer;
- a back-end-of-line (BEOL) layer that includes a thermal transfer structure in contact with the FEOL layer;
- and
- a carrier wafer bonded to the BEOL layer that includes a thermal dissipation structure in thermal contact with the thermal transfer structure.
1 more element
A semiconductor device, comprising:
- a front-end-of-line (FEOL) layer that includes a thermal via;
- a back-end-of-line (BEOL) layer that includes a first thermal transfer structure in thermal contact with the thermal via;
- a backside layer, on a side of the FEOL opposite to the BEOL layer, that includes a second thermal transfer structure in thermal contact with the thermal via;
- and
- a carrier wafer bonded to the BEOL layer that includes a thermal dissipation structure thermal in contact with the first thermal transfer structure.
2 more elements
A method of forming a semiconductor device, comprising:
- forming a front-end-of-line (FEOL) layer;
- forming a back-end-of-line (BEOL) layer on the FEOL layer that includes a first thermal transfer structure;
- forming a first bonding layer on the BEOL layer that includes a thermal via in thermal contact with the first thermal transfer structure;
- and
- bonding a carrier wafer to the BEOL layer using the first bonding layer.
2 more elements
Dependencies are inferred from the claim text.