Electronic device including rigid dielectric lid and overlaying thermoset polymer layer and related methods
AssigneeEagle Technology, LLC
InventorsLouis R. PARADISO, Douglas R. HEILMAN
Life of this patent
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Abstract
An electronic device may include a dielectric substrate and bond wire pads on an upper surface thereof. The electronic device may also include a radio frequency (RF) integrated circuit (IC) mounted to the upper surface of the dielectric substrate and bond wires coupling the RF IC to respective bond wire pads. The electronic device may also include a rigid dielectric lid mounted to the upper surface of the dielectric substrate to define an air cavity above the RF IC and the bond wires, and a thermosetting polymer layer over the rigid dielectric lid.
Claims20
An electronic device comprising:
- a dielectric substrate and a plurality of bond wire pads on an upper surface thereof;
- a radio frequency (RF) integrated circuit (IC) mounted to the upper surface of the dielectric substrate;
- a plurality of bond wires coupling the RF IC to respective bond wire pads;
- a rigid dielectric lid mounted to the upper surface of the dielectric substrate to define an air cavity above the RF IC and the plurality of bond wires;
- and
- a thermoset polymer layer over the rigid dielectric lid.
An electronic device comprising:
- a dielectric substrate and a plurality of bond wire pads on an upper surface thereof;
- a Monolithic Microwave Integrated Circuit (MMIC) mounted to the upper surface of the dielectric substrate;
- a plurality of bond wires coupling the MMIC to respective bond wire pads;
- a rigid dielectric lid mounted to the upper surface of the dielectric substrate to define an air cavity above the RF IC and the plurality of bond wires;
- an adhesive securing the rigid dielectric lid to the upper surface of the dielectric substrate;
- and
- a thermoset polymer layer over the rigid dielectric lid.
A method for making an electronic device comprising:
- mounting a radio frequency (RF) integrated circuit (IC) to an upper surface of a dielectric substrate having a plurality of bond wire pads on the upper surface thereof;
- coupling a plurality of bond wires between the RF IC and respective bond wire pads;
- mounting a rigid dielectric lid to the upper surface of the dielectric substrate to define an air cavity above the RF IC and the plurality of bond wires;
- and
- curing a thermoset polymer layer over the rigid dielectric lid.
Dependencies are inferred from the claim text.