Semiconductor device

A semiconductor device comprising:

• a semiconductor element;
• a conductive member electrically connected to the semiconductor element;
• and
• a sealing resin covering the semiconductor element,
• wherein the conductive member includes:
• a first lead including a mounting portion on which the semiconductor element is mounted and a first terminal connected to the mounting portion;
• and
• a second lead including a second terminal,
• each of the first terminal and the second terminal includes a portion protruding from the sealing resin in a first direction orthogonal to a thickness direction of the mounting portion,
• the sealing resin includes:
• a resin obverse surface and a resin reverse surface facing away from each other in the thickness direction;
• and
• a resin end surface connected to the resin obverse surface and the resin reverse surface and facing in a direction in which the first terminal and the second terminal protrude, and
• at the resin end surface, the first terminal and the second terminal are spaced apart from each other in a second direction orthogonal to the thickness direction and the first direction and spaced apart from each other in the thickness direction.