Glass layer with litho defined through-glass via

An electronic system comprising:

• a die;
• a substrate coupled to the die comprising;
• a prepatterned glass layer, the prepatterned glass layer comprising:
• a first exposed surface and a second exposed surface;
• a plurality of through holes formed within the prepatterned glass layer, each of the plurality of through holes has a first end and a second end;
• and
• a layer of copper plating extending within each through hole of the plurality of through holes, the copper plating including a first copper plating surface corresponding with the first end and a second copper plating surface corresponding with the second end;
• wherein the first copper plating surface includes a ring flush with the first exposed surface and circumnavigating an interior of each of the plurality of through holes;
• wherein the second copper plating surface includes a ring flush with the second exposed surface and circumnavigating the interior of each of the plurality of through holes.

A method of forming a layer for an electrical system comprising:

• forming a plurality of through glass vias in a glass layer, the each of the plurality of through glass vias having a first opening and an opposing second opening;
• fixing a first seed layer to a first surface of the glass layer and fixing a second seed layer to a second surface of the glass layer;
• wherein the second surface of the glass layer opposes the first surface of the glass layer;
• laminating dry film photoresist over the seed layer on the first surface and the second surface;
• removing the dry film photoresist and seed layer from an area corresponding to the first opening and opposing second opening of the plurality of through glass vias;
• depositing copper plating in each through glass via of the plurality of through glass vias;
• and
• removing the dry film photoresist and seed layer from the first surface and the second surface.