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US 2024/0203805 A1Published application
Embedded memory for glass core packages
AssigneeIntel Corporation
InventorsMohammad Mamunur RAHMAN, Brandon C. MARIN, Gang DUAN
Life of this patent
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Abstract
Embodiments disclosed herein include electronic package packages. In an embodiment, the electronic package comprises a package substrate. In an embodiment, a first die is embedded in the package substrate, and a second die is over the package substrate. In an embodiment, the first die is entirely within a footprint of the second die.
Claims20
An electronic package, comprising:
- a package substrate;
- a first die embedded in the package substrate;
- and
- a second die over the package substrate, wherein the first die is entirely within a footprint of the second die.
1 more element
An electronic package, comprising:
- a package substrate with a core, wherein the core comprises glass;
- a first die over the package substrate;
- a second die over the package substrate and adjacent to the first die;
- a third die embedded in the package substrate, wherein the third die is entirely within a footprint of the first die;
- and
- a fourth die embedded in the package substrate, wherein the fourth die is within the footprint of the first die and within a footprint of the second die.
3 more elements
A computing system, comprising:
- a board;
- an electronic package coupled to the board, wherein the electronic package comprises:
- a package substrate;
- a first die embedded in the package substrate, wherein the first die is a memory die;
- and
- a second die over the package substrate, wherein the first die is entirely within a footprint of the second die.
3 more elements
Dependencies are inferred from the claim text.