Semiconductor devices and methods of manufacturing semiconductor devices

An electronic device, comprising:

• a substrate comprising a top side, a bottom side, a lateral side, and a conductive structure;
• a first electronic component over the top side of the substrate and coupled with the conductive structure, wherein the first electronic component comprises a component interconnect on a bottom side of the first electronic component;
• a second electronic component over the top side of the substrate and coupled with the conductive structure;
• an encapsulant contacting the top side of the substrate, the bottom side of the substrate, and the lateral side of the substrate;
• a lid over the first electronic component, over the second electronic component, and over the encapsulant;
• and
• an underfill between the top side of the substrate and the bottom side of the first electronic component and contacting the component interconnect, wherein the second electronic component is external to the underfill.

A method to manufacture an electronic device, comprising:

• providing a substrate comprising a top side, a bottom side, a lateral side, a conductive structure, and a first electronic component over the top side of the substrate and coupled with the conductive structure;
• providing a top mold chase over the top side of the substrate and a bottom mold chase below the bottom side of the substrate, wherein the top mold chase has a first cavity between a first bar and a second bar, wherein the bottom mold chase has a second cavity;
• providing an encapsulant contacting the top side of the substrate, the bottom side of the substrate, and the lateral side of the substrate, wherein the encapsulant is external to the first cavity and is in the second cavity;
• removing the top mold chase and the bottom mold chase;
• providing a second electronic component over the top side of the substrate and coupled with the conductive structure;
• and
• providing a lid over the top side of the substrate, wherein the lid is over the first electronic component, the second electronic component, and the encapsulant.