Package housing
AssigneeHunan San'an Semiconductor Co., Ltd.
InventorsNing YANG, Liule WANG, Hao CHEN
Life of this patent
Estimating the term…
Loading patent…
AssigneeHunan San'an Semiconductor Co., Ltd.
InventorsNing YANG, Liule WANG, Hao CHEN
Estimating the term…
A package housing is provided and includes: an outer frame, a cover, a heat dissipation bottom plate, and a fixing structure. The cover is connected to a side of the outer frame. The heat dissipation bottom plate is connected to the other side of the outer frame, wherein the heat dissipation bottom plate, the outer frame, and cover cooperatively define a receiving space, the outer frame has a connecting member disposed inside the receiving space, the connecting member is disposed between the heat dissipation bottom plate and the cover. The fixing structure is configured to connect the connecting member to the cover, wherein a part of the fixing structure located in the receiving space has an autographic projection on the connecting member, and the entire autographic projection locates on a surface of the connecting member near the cover.
A package housing, comprising:
A package housing, comprising:
Dependencies are inferred from the claim text.