Test pad on device lead for test contactor

A semiconductor package, comprising:

• a semiconductor die having a top side with bond pads;
• a leadframe including a die attach pad, a bottom side of the semiconductor die mounted on the die attach pad using a die attach material, the leadframe having at least one lead with a top surface and a bottom surface, wherein at least one bond pad is coupled to the top surface of at least one lead by a bond wire;
• a mold compound covering the semiconductor die, the bond wires, and at least a portion of the at least one lead;
• and
• a test pad located on or adjacent to the bottom surface of the at least one lead, the test pad electrically coupled to the at least one lead.

An integrated circuit (IC) package, comprising:

• a leadframe including a die attach pad and a plurality of leads spaced apart from the die attach pad, each lead having a top surface and a bottom surface;
• a semiconductor die having a top side with bond pads and a bottom side mounted on the die attach pad using a die attach material, wherein the bond pads are individually coupled to the top surface of selected ones of the leads by bond wires;
• a mold compound covering the semiconductor die, the bond wires, and at least a portion of the plurality of leads;
• and
• each of the plurality of leads having a test pad located on or adjacent to the bottom surface of the lead, each test pad electrically coupled to a respective lead.