Member for semiconductor manufacturing apparatus

Abstract

A member for semiconductor manufacturing apparatus includes a ceramic plate having a circular wafer placement surface having a seal band along an outer periphery, and an annular focus ring placement surface located outside the wafer placement surface and below the wafer placement surface; a circular inner heater electrode embedded in the ceramic plate; an annular outer heater electrode embedded in the ceramic plate and surrounding the inner heater electrode; and a cooling plate disposed at a surface of the ceramic plate opposite the wafer placement surface, wherein the inner heater electrode overlaps at least a portion of the seal band in plan view, and an outer diameter of the inner heater electrode is not less than 97% of an outer diameter of the wafer placement surface.

Dependencies are inferred from the claim text.