Apparatus and method for wafer alignment

A method, comprising:

• loading a target substrate with a first surface onto a substrate stage, wherein the first surface includes a first alignment mark;
• providing a die having a second surface on a carrier substrate, wherein the second surface includes a second alignment mark;
• coupling the die with a die handler, wherein the die handler includes a third alignment mark, and including performing a first alignment process to align the die with the die handler using the second alignment mark and the third alignment mark;
• placing the die coupled to the die handler on the first surface of the target substrate, including performing a second alignment process to align the coupled die and the die handler with the target substrate using the first alignment mark and at least one of the second alignment mark or the third alignment mark;
• and
• performing a bonding process to fuse the first surface with the second surface.

An apparatus, comprising:

• a substrate stage configured to receive and move a target substrate, wherein the substrate stage includes a first alignment mark;
• an alignment detection module configured to facilitate an alignment process of the target substrate;
• a substrate handler configured to receive and move a carrier substrate having a die disposed thereon, wherein the die includes a second alignment mark;
• and
• a die handler configured to receive and move the die from the carrier substrate, wherein the die handler includes a third alignment mark corresponding to the first alignment mark and the second alignment mark.