Substrate processing apparatus, substrate processing system, and data processing method

A substrate processing system that comprises a thickness gauge apparatus that measures thickness of an object included in a substrate and a substrate processing apparatus that performs substrate processing, which is processing of the substrate, after the thickness gauge apparatus measures the thickness of the object, the substrate processing apparatus including:

• a controller that enters input data in a trained model, which outputs processing conditions when the substrate processing is performed, to cause the trained model to output the processing conditions, the input data indicating a target value for a processing amount by the substrate processing;
• and
• storage that stores reference data acquired based on pieces of training data used to construct the trained model, wherein
• the training data indicates a processing amount by the substrate processing during training, and
• the controller:
• acquires pre-processing measurement data from measurement results by the thickness gauge apparatus, the pre-processing measurement data indicating the thickness of the object before the substrate processing is performed;
• creates the input data based on the pre-processing measurement data and target data indicating a target value for the thickness of the object;
• and
• compares the input data and the reference data to determine whether or not to perform the substrate processing.

A substrate processing system comprising:

• a thickness gauge apparatus that measures thickness of an object included in a substrate;
• a determining apparatus that determines whether or not to perform substrate processing, which is processing of the substrate;
• and
• a substrate processing apparatus that causes a trained model, which outputs processing conditions when the substrate processing is performed, to output the processing conditions to perform the substrate processing, wherein
• the determining apparatus includes
• storage that stores reference data acquired based on pieces of training data used to construct the trained model,
• a determining device that determines whether or not to perform the substrate processing,
• the training data indicates a processing amount by the substrate processing during training,
• the determining device:
• acquires pre-processing measurement data from measurement results by the thickness gauge apparatus, the pre-processing measurement data indicating the thickness of the object before the substrate processing is performed;
• creates input data based on target data and the pre-processing measurement data, the input data indicating a target value for a processing amount by the substrate processing, the target data indicating a target value for the thickness of the object;
• compares the input data and the reference data to determine whether or not to perform the substrate processing,
• the substrate processing apparatus includes a controller that, when the determining apparatus determines to perform the substrate processing, enters the input data in the trained model to cause the trained model to output the processing conditions.

A data processing method, comprising:

• measuring thickness of an object included in a substrate before substrate processing is performed to acquire pre-processing measurement data indicating measurement results of the thickness of the object;
• creating input data based on target data and the pre-processing measurement data, the input data indicating a target value for a processing amount by the substrate processing, the target data indicating a target value for the thickness of the object;
• and
• comparing reference data and the input data to determine whether or not to perform the substrate processing, the reference data being acquired based on pieces of training data used to construct a trained model, wherein
• the training data indicates a processing amount by the substrate processing during training,
• the trained model outputs, in response to the input data being entered therein, processing conditions when the substrate processing is performed.