Wafer-level die-transfer tool and method

A die-transfer method, comprising:

• attaching a frontside of a wafer to a first tape;
• performing a die sawing process to a backside of the wafer, wherein the die sawing process cut the wafer into a plurality of dies;
• providing a second tape over the first tape with an adhesive surface of the second tape facing the backsides of the dies;
• after the die sawing process, moving the second tape downward to a first position above backsides of the dies;
• applying a downward pressure from above the second tape so that the backsides of the dies contact and adhere to the second tape;
• and
• detaching the dies from the first tape by elevating the second tape to a second position higher than the first position.

A die-transfer method, comprising:

• attaching a frontside of a wafer to a first tape;
• performing a die sawing process to a backside of the wafer, wherein the die sawing process cut the wafer into a plurality of dies;
• after the die sawing process, moving a second tape downward to a first position above backsides of the dies;
• pressing a portion of the second tape to a second position lower than the first position, wherein the portion of the second tape is in contact with the backsides of the dies;
• and
• detaching the dies from the first tape by elevating the second tape to a third position higher than the first position.