Sheet, handling sheet for thinned wafer, method for handling thin wafer, and method for handling thin device

Abstract

A sheet including a plurality of structures being cylindrical or hemicylindrical with 50 to 500 microns in height and 10 microns to 1 mm in diameter or prismatic structures with 100 microns to 1 mm in length and 10 microns to 1 mm in thickness on a surface, wherein the sheet has a configuration wherein the structures plurality are arranged with a same interval or a configuration wherein the structures plurality are arrayed so that the intervals maximum value is less than three times minimum value of the surface intervals, and the sheet is molded with thermosetting resin. This provides: a sheet enabling to easily handle a thinned wafer and rearranged devices sealed with a mold and having excellent chemical resistance; a handling sheet for thinned wafer including the sheet; and a method for handling thin wafer using handling sheet for thinned wafer and method for handling a thin device.

Dependencies are inferred from the claim text.