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AssigneeSemiconductor Components Industries, LLC
InventorsMichael J. SEDDON, Francis J. CARNEY, Chee Hiong CHEW, Soon Wei WANG, Eiji KUROSE
Estimating the term…
Implementations of a method of forming a semiconductor package may include forming a plurality of notches into the first side of a semiconductor substrate; forming an organic material over the first side of the semiconductor substrate and into the plurality of notches; forming a cavity into each of a plurality of semiconductor die included in the semiconductor substrate; applying a backmetal into the cavity in each of the plurality of semiconductor die included in the semiconductor substrate; and singulating the semiconductor substrate through the organic material into a plurality of semiconductor packages.
A semiconductor package comprising:
A semiconductor package comprising:
A semiconductor package comprising:
Dependencies are inferred from the claim text.