Reusable templates for semiconductor design and fabrication

A semiconductor assembly comprising:

• a substrate comprising:
• a location for coupling one or more chiplets to the substrate, the location having dimensions that bound dimensions of additional chiplets capable of being coupled to the substrate in the location, the location including:
• an interface region including connections for one or more die-to-die interfaces of the one or more chiplets;
• and
• a power region that includes a power interface having connections for the one or more chiplets;
• and
• at least one chiplet coupled to at least a subset of the connections in the interface region and to a subset of the connections in the power region, the at least one chiplet having dimensions that do not exceed dimensions of the location.