Apparatus for processing substrate and method of processing substrate

A method of processing a substrate, including replacing components included in an apparatus for processing a substrate and backing up the apparatus, the method comprising:

• wherein the backing up the apparatus includes:
• a preheating operation in which a temperature adjusting unit increases a temperature of a processing space by increasing a temperature of coolant supplied to a process chamber;
• and
• a bake purge operation performed after the preheating operation and including removing impurities including moisture contained in the component and/or particles attached to the component.

An apparatus for processing a substrate, the apparatus comprising:

• a process chamber having a processing space therein and a cooling path through which the coolant flows;
• a support unit disposed in the processing space and including a body configured to support a substrate and a heating unit configured to heat the substrate;
• a pressure reduction unit connected to an exhaust line configured to discharge impurities in the processing space, and configured to provide negative pressure to the processing space;
• a gas supply unit provided on one sidewall of the process chamber and configured to supply gas to the processing space;
• a microwave application unit disposed above the support unit and configured to generate and apply microwaves;
• a radiation unit configured to transmit the generated microwaves to the processing space;
• a temperature adjusting unit configured to supply the coolant to the cooling path and to control a temperature of the coolant;
• and
• a controller,
• wherein the controller increases a temperature of the processing space by increasing a temperature of the coolant by controlling the temperature adjusting unit.