Transparent conductive film and method for forming transparent conduction pattern

A transparent conducting film comprising:

• a resin film which is a substrate,
• a first transparent conducting pattern layer formed on a first main face of the resin film,
• a second transparent conducting pattern layer formed on a second main face of the resin film, the pattern of the second transparent conducting pattern layer being different from the pattern of the first transparent conducting pattern layer,
• a first protection layer formed on the first transparent conducting pattern layer, and
• a second protection layer formed on the second transparent conducting pattern layer, wherein
• the first transparent conducting pattern layer consists of a first conducting region and a first non-conducting region,
• the first conducting region contains a binder resin and a nano-structured network having metal nanowire intersections,
• the second transparent conducting pattern layer has a second conducting region,
• the second conducting region contains a binder resin and a nano-structured network having metal nanowire intersections,
• the resin film contains a base resin and an ultraviolet absorbent, and has a light transmittance of 10% or less in a region of wavelength 350 to 370 nm in an optical transmission spectrum, and a film of the base resin having a thickness same as the thickness of the resin film has a light transmittance of 80% or more in a region of wavelength 350 to 700 nm in an optical transmission spectrum.

A method for forming a transparent conducting pattern comprising:

• a transparent conducting layer forming step for forming a first transparent conducting layer containing a binder resin and a nano-structured network having metal nanowire intersections, on a first main face of a resin film, and forming a second transparent conducting layer containing a binder resin and a nano-structured network having metal nanowire intersections on a second main face of the resin film, respectively,
• a protection layer forming step for forming a first protection layer on the first transparent conducting layer, and forming a second protection layer on the second transparent conducting layer, respectively, and
• a pattern forming step for forming a first transparent conducting pattern by etching only the first transparent conducting layer from the first protection layer side using pulse laser having a wavelength within a range of 350 to 370 nm, and a pulse width of shorter than 1 nanosecond, wherein
• the resin film contains a base resin and an ultraviolet absorbent, and has a light transmittance of 10% or less in a region of wavelength 350 to 370 nm in an optical transmission spectrum, and a film of the base resin having a thickness of same as the thickness of the resin film has a light transmittance of 80% or more in a region of wavelength 350 to 700 nm in an optical transmission spectrum.