Optical inspection of a wafer

An optical inspection system, comprising:

• an image analysis device configured to:
• binarize an image of a wafer;
• determine a bump pattern based on the binarized image;
• identify an angular section of the wafer in which the bump pattern is not present;
• calculate an angle associated with the angular section;
• determine whether the angle satisfies an open angle threshold;
• and
• send a signal indicating a plating issue based on the angle satisfying the open angle threshold.

A method, comprising:

• binarizing, by an optical inspection system, an image of a wafer;
• identifying, by the optical inspection system, an angular section of the wafer in which a bump pattern is not present based on binarizing the image;
• calculating, by the optical inspection system, an angle associated with the angular section;
• and
• sending, by the optical inspection system, a signal indicating a plating issue based on the angle satisfying an open angle threshold.