Compound For Forming Metal-Containing Film, Composition For Forming Metal-Containing Film, And Patterning Process

A compound for forming a metal-containing film to be contained in a composition for forming a metal-containing film used in manufacturing a semiconductor, wherein

• the compound is represented by the following general formula (A),
• wherein M represents Ti, Zr, or Hf;
• Ra1, Ra2, Ra3, and Ra4 each represent an organic group of the following general formula (1), a silicon-containing organic group of the following general formula (2), or an alkyl group having 1 to 10 carbon atoms, at least one of Ra1, Ra2, Ra3, and Ra4 being an organic group of the following general formula (1) and at least one of Ra1, Ra2, Ra3, and Ra4 being a silicon-containing organic group of the following general formula (2);
• and “n” represents 1 to 30,
• wherein “p” represents 0 or 1;
• “*” represents an attachment point to an oxygen atom;
• when “p” represents 1 and W represents an alkoxy group having 1 to 10 carbon atoms, X represents an unsaturated divalent organic group having 2 to 20 carbon atoms;
• when “p” represents 1 and W represents the following general formula (1A), X represents a saturated divalent organic group having 1 to 20 carbon atoms or an unsaturated divalent organic group having 2 to 20 carbon atoms;
• and when “p” represents 0, X represents a monovalent organic group having 2 to 30 carbon atoms and containing a crosslinking group having a structure represented by one of the following general formulae (b-1) and (b-2),
• wherein Y represents a saturated divalent organic group having 1 to 20 carbon atoms or an unsaturated divalent organic group having 2 to 20 carbon atoms;
• RA represents a structure represented by one of the following general formulae (a-1) to (a-3);
• “h” represents 1 to 6;
• and “*” represents an attachment point to a carbon atom of a carbonyl group,
• wherein each R1 independently represents a hydrogen atom or a monovalent organic group having 1 to 10 carbon atoms;
• each “q” independently represents 0 or 1;
• and “*” represents an attachment point to Y,
• wherein each R2 independently represents a hydrogen atom or a monovalent organic group having 1 to 10 carbon atoms;
• each “q” independently represents 0 or 1;
• and “*” represents an attachment point,
• wherein R3A, R3B, and R3C each represent an organic group selected from an organic group having 2 to 30 carbon atoms and containing a crosslinking group having a structure represented by one of the following general formulae (c-1) to (c-3), a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms, and an aryl group having 6 to 20 carbon atoms;
• when the “p” in the general formula (1) represents 1 and the W represents an alkoxy group having 1 to 10 carbon atoms, at least one of R3A, R3B, and R3C represents an organic group having 2 to 30 carbon atoms and containing a crosslinking group having a structure represented by one of the following general formulae (c-1) to (c-3);
• and “*” represents an attachment point to an oxygen atom,
• wherein each R3 independently represents a hydrogen atom or a monovalent organic group having 1 to 10 carbon atoms;
• each “q” independently represents 0 or 1;
• and “*” represents an attachment point.