Chiplet communication using an optical communication substrate

A method for manufacturing a computing system, comprising:

• obtaining a photonic interposer having an optical network comprising a plurality of waveguides and a plurality of controllable optical switches;
• bonding an electronic die to the photonic interposer through a surface of the electronic die, wherein the bonding comprises connecting the electronic die to the photonic interposer using:
• an inner interface comprising a first plurality of ports electrically coupling the electronic die to the photonic interposer through the surface;
• and
• an outer interface comprising a second plurality of ports electrically coupling the electronic die to the photonic interposer through the surface, wherein the outer interface at least partially encloses the inner interface.

A computing system comprising:

• a photonic interposer having an optical network comprising a plurality of waveguides and a plurality of controllable optical switches;
• a first electronic die having a first surface bonded to the photonic interposer, the first electronic die having:
• a first inner interface comprising a first plurality of ports electrically coupling the first electronic die to the photonic interposer;
• and
• a first outer interface comprising a second plurality of ports electrically coupling the first electronic die to the photonic interposer, wherein the first outer interface at least partially encloses the first inner interface;
• and
• a second electronic die having a surface bonded to the photonic interposer, the second electronic die having:
• a second inner interface comprising a third plurality of ports electrically coupling the second electronic die to the photonic interposer;
• and
• a second outer interface comprising a fourth plurality of ports electrically coupling the second electronic die to the photonic interposer, wherein the second outer interface at least partially encloses the second inner interface,
• wherein the optical network optically couples at least one port of the first inner interface to at least one port of the second inner interface.