Manufacturing method of semiconductor device and test socket for use in the same

A manufacturing method of a semiconductor device comprising steps of:

• (a) preparing a test object, the test object including a body sealing a semiconductor chip and a lead terminal electrically connected to the semiconductor chip and having a lead upper surface and a lead bottom surface opposite to the lead upper surface;
• (b) preparing a test socket, the test socket including a mounting portion for placing the test object, and a first contact pin disposed around the mounting portion;
• and
• (c) performing an electrical test of the semiconductor chip so as to contact the lead terminal with the first contact pin, wherein
• the lead terminal has a protruding portion protruded from the body, a connecting portion connected to a mounting substrate and a bending portion connected between the protruding portion and the connecting portion, and
• in the step of (c), the first contact pin contacts with the lead bottom surface of the protruding portion.