Back to results
US 2024/0200628 A1Published application
Friction material composition and friction material
AssigneeAdvics Co., Ltd.
InventorsJunichi UJITA, Hiroki HASEGAWA
Life of this patent
Estimating the term…
Abstract
A friction material composition including a fiber substrate, a binder, an organic filler and an inorganic filler, wherein the content of copper in the friction material composition is 5% by mass or less in terms of elemental copper, and the friction material composition includes magnesite as the inorganic filler.
Claims20
A friction material composition comprising a fiber substrate, a binder, an organic filler and an inorganic filler,
- wherein the content of copper in the friction material composition is 5% by mass or less in terms of elemental copper, and the friction material composition comprises magnesite as the inorganic filler.
Dependencies are inferred from the claim text.